Package Housing
Microwave Components
Hybrid Integrated Circuit
Electronic CeramicsHybrid Integrated Circuit Packages
DATE：2016/9/9 VIEW：930
| ◆ UP Series |
Current： |
Max 100A |
|
| ◆ UPP Series |
Current： |
Max 3000V DC |
|
| ◆ Flat Packages |
Pin Pitch： |
Min 1.27mm |
|
| ◆Flat Power Packages |
Hermeticity： |
≦ 1x10-3Pa•cm³/s(He) |
|
| ◆Platform Packages |
Insulator Resistance： |
≥ 1x1010Ω（500VDC） |
|
|
Salt-Frog Test ： |
24h，some with 48h |
Products cover reliable DC/DC converters, filters, power amplifiers, press sensor packaging, etc, which applied in auto mobile, medical, national defense, aviation and aerospace, etc.
